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CMOS-Compatible Key Engineering Devices for High-Speed Silicon-Based Optical Interconnections
Buch von Jing Wang
Sprache: Englisch

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Beschreibung
This book discusses some research results for CMOS-compatible silicon-based optical devices and interconnections. With accurate simulation and experimental demonstration, it provides insights on silicon-based modulation, advanced multiplexing, polarization and efficient coupling controlling technologies, which are widely used in silicon photonics. Researchers, scientists, engineers and especially students in the field of silicon photonics can benefit from the book. This book provides valuable knowledge, useful methods and practical design that can be considered in emerging silicon-based optical interconnections and communications. And it also give some guidance to student how to organize and complete an good dissertation.
This book discusses some research results for CMOS-compatible silicon-based optical devices and interconnections. With accurate simulation and experimental demonstration, it provides insights on silicon-based modulation, advanced multiplexing, polarization and efficient coupling controlling technologies, which are widely used in silicon photonics. Researchers, scientists, engineers and especially students in the field of silicon photonics can benefit from the book. This book provides valuable knowledge, useful methods and practical design that can be considered in emerging silicon-based optical interconnections and communications. And it also give some guidance to student how to organize and complete an good dissertation.
Über den Autor

Dr. Jing Wang received his B.S. degree in Electrical Engineering from the University of Science and Technology of China (USTC) in 2010. He then joined Prof. Fuwan Gan's group at Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences (SIMIT, CAS) and received his Ph.D. degree in 2015. He studied at Purdue University as a joint Ph.D. student from 2013-2014. From 2015-2018, he worked as a senior research engineer and project manager in Huawei Technologies Co. Ltd., Shenzhen, China. He is currently a co-founder of a start-up company on solid-state Lidar.

His research interests cover various silicon photonic devices for optical interconnection and sensing. He has published more than 20 conference and journal papers, and holds more than 10 patents. He won a National Scholarship for Doctoral Students and the CAS President Fellowships in 2014 and 2015, respectively. In addition, his dissertation was selected as a CAS Excellent DoctoralDissertation in 2016. He was also included in Shenzhen's high-level talent plan in 2015.

Zusammenfassung

Nominated as an outstanding PhD thesis by the University of the Chinese Academy of Sciences

Is the first book presenting solutions on four typical technical challenges in silicon optical interconnections

Introduces novel design processes, device structures, and breakthrough results in some issues

Inhaltsverzeichnis
Introduction.- CMOS-compatible silicon electro-optic modulator.- CMOS-compatible silicon advanced multiplexing scheme.- CMOS-compatible silicon polarization splitter and rotator.- CMOS-compatible high-efficiency silicon fiber-to-chip coupler.- Summary.
Details
Erscheinungsjahr: 2018
Fachbereich: Nachrichtentechnik
Genre: Importe, Technik
Rubrik: Naturwissenschaften & Technik
Medium: Buch
Inhalt: xi
199 S.
3 s/w Illustr.
152 farbige Illustr.
199 p. 155 illus.
152 illus. in color.
ISBN-13: 9789811333774
ISBN-10: 9811333777
Sprache: Englisch
Einband: Gebunden
Autor: Wang, Jing
Auflage: 1st edition 2019
Hersteller: Springer Singapore
Springer Nature Singapore
Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, D-69121 Heidelberg, juergen.hartmann@springer.com
Maße: 241 x 160 x 18 mm
Von/Mit: Jing Wang
Erscheinungsdatum: 05.12.2018
Gewicht: 0,489 kg
Artikel-ID: 114820103
Über den Autor

Dr. Jing Wang received his B.S. degree in Electrical Engineering from the University of Science and Technology of China (USTC) in 2010. He then joined Prof. Fuwan Gan's group at Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences (SIMIT, CAS) and received his Ph.D. degree in 2015. He studied at Purdue University as a joint Ph.D. student from 2013-2014. From 2015-2018, he worked as a senior research engineer and project manager in Huawei Technologies Co. Ltd., Shenzhen, China. He is currently a co-founder of a start-up company on solid-state Lidar.

His research interests cover various silicon photonic devices for optical interconnection and sensing. He has published more than 20 conference and journal papers, and holds more than 10 patents. He won a National Scholarship for Doctoral Students and the CAS President Fellowships in 2014 and 2015, respectively. In addition, his dissertation was selected as a CAS Excellent DoctoralDissertation in 2016. He was also included in Shenzhen's high-level talent plan in 2015.

Zusammenfassung

Nominated as an outstanding PhD thesis by the University of the Chinese Academy of Sciences

Is the first book presenting solutions on four typical technical challenges in silicon optical interconnections

Introduces novel design processes, device structures, and breakthrough results in some issues

Inhaltsverzeichnis
Introduction.- CMOS-compatible silicon electro-optic modulator.- CMOS-compatible silicon advanced multiplexing scheme.- CMOS-compatible silicon polarization splitter and rotator.- CMOS-compatible high-efficiency silicon fiber-to-chip coupler.- Summary.
Details
Erscheinungsjahr: 2018
Fachbereich: Nachrichtentechnik
Genre: Importe, Technik
Rubrik: Naturwissenschaften & Technik
Medium: Buch
Inhalt: xi
199 S.
3 s/w Illustr.
152 farbige Illustr.
199 p. 155 illus.
152 illus. in color.
ISBN-13: 9789811333774
ISBN-10: 9811333777
Sprache: Englisch
Einband: Gebunden
Autor: Wang, Jing
Auflage: 1st edition 2019
Hersteller: Springer Singapore
Springer Nature Singapore
Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, D-69121 Heidelberg, juergen.hartmann@springer.com
Maße: 241 x 160 x 18 mm
Von/Mit: Jing Wang
Erscheinungsdatum: 05.12.2018
Gewicht: 0,489 kg
Artikel-ID: 114820103
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