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Dr. Jing Wang received his B.S. degree in Electrical Engineering from the University of Science and Technology of China (USTC) in 2010. He then joined Prof. Fuwan Gan's group at Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences (SIMIT, CAS) and received his Ph.D. degree in 2015. He studied at Purdue University as a joint Ph.D. student from 2013-2014. From 2015-2018, he worked as a senior research engineer and project manager in Huawei Technologies Co. Ltd., Shenzhen, China. He is currently a co-founder of a start-up company on solid-state Lidar.
His research interests cover various silicon photonic devices for optical interconnection and sensing. He has published more than 20 conference and journal papers, and holds more than 10 patents. He won a National Scholarship for Doctoral Students and the CAS President Fellowships in 2014 and 2015, respectively. In addition, his dissertation was selected as a CAS Excellent DoctoralDissertation in 2016. He was also included in Shenzhen's high-level talent plan in 2015.
Nominated as an outstanding PhD thesis by the University of the Chinese Academy of Sciences
Is the first book presenting solutions on four typical technical challenges in silicon optical interconnections
Introduces novel design processes, device structures, and breakthrough results in some issues
Erscheinungsjahr: | 2018 |
---|---|
Fachbereich: | Nachrichtentechnik |
Genre: | Importe, Technik |
Rubrik: | Naturwissenschaften & Technik |
Medium: | Buch |
Inhalt: |
xi
199 S. 3 s/w Illustr. 152 farbige Illustr. 199 p. 155 illus. 152 illus. in color. |
ISBN-13: | 9789811333774 |
ISBN-10: | 9811333777 |
Sprache: | Englisch |
Einband: | Gebunden |
Autor: | Wang, Jing |
Auflage: | 1st edition 2019 |
Hersteller: |
Springer Singapore
Springer Nature Singapore |
Verantwortliche Person für die EU: | Springer Verlag GmbH, Tiergartenstr. 17, D-69121 Heidelberg, juergen.hartmann@springer.com |
Maße: | 241 x 160 x 18 mm |
Von/Mit: | Jing Wang |
Erscheinungsdatum: | 05.12.2018 |
Gewicht: | 0,489 kg |
Dr. Jing Wang received his B.S. degree in Electrical Engineering from the University of Science and Technology of China (USTC) in 2010. He then joined Prof. Fuwan Gan's group at Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences (SIMIT, CAS) and received his Ph.D. degree in 2015. He studied at Purdue University as a joint Ph.D. student from 2013-2014. From 2015-2018, he worked as a senior research engineer and project manager in Huawei Technologies Co. Ltd., Shenzhen, China. He is currently a co-founder of a start-up company on solid-state Lidar.
His research interests cover various silicon photonic devices for optical interconnection and sensing. He has published more than 20 conference and journal papers, and holds more than 10 patents. He won a National Scholarship for Doctoral Students and the CAS President Fellowships in 2014 and 2015, respectively. In addition, his dissertation was selected as a CAS Excellent DoctoralDissertation in 2016. He was also included in Shenzhen's high-level talent plan in 2015.
Nominated as an outstanding PhD thesis by the University of the Chinese Academy of Sciences
Is the first book presenting solutions on four typical technical challenges in silicon optical interconnections
Introduces novel design processes, device structures, and breakthrough results in some issues
Erscheinungsjahr: | 2018 |
---|---|
Fachbereich: | Nachrichtentechnik |
Genre: | Importe, Technik |
Rubrik: | Naturwissenschaften & Technik |
Medium: | Buch |
Inhalt: |
xi
199 S. 3 s/w Illustr. 152 farbige Illustr. 199 p. 155 illus. 152 illus. in color. |
ISBN-13: | 9789811333774 |
ISBN-10: | 9811333777 |
Sprache: | Englisch |
Einband: | Gebunden |
Autor: | Wang, Jing |
Auflage: | 1st edition 2019 |
Hersteller: |
Springer Singapore
Springer Nature Singapore |
Verantwortliche Person für die EU: | Springer Verlag GmbH, Tiergartenstr. 17, D-69121 Heidelberg, juergen.hartmann@springer.com |
Maße: | 241 x 160 x 18 mm |
Von/Mit: | Jing Wang |
Erscheinungsdatum: | 05.12.2018 |
Gewicht: | 0,489 kg |