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Cover: 9781461410706 | Compact Models and Measurement Techniques for High-Speed Interconnects
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Compact Models and Measurement Techniques for High-Speed Interconnects
Taschenbuch von Tapas Chakravarty (u. a.)
Sprache: Englisch

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Beschreibung
Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.
Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.
Zusammenfassung

Provides a comparative study of the available analytical and numerical approaches in modeling of high-speed electrical interconnects

Modeling aspects will be highlighted specific to interconnect geometry

Includes supplementary material: [...]

Inhaltsverzeichnis
Introduction to interconnects.- Necessity for modeling of interconnects.- Review of analytical models.- Numerical techniques and simulation approaches.- Summary.
Details
Erscheinungsjahr: 2012
Fachbereich: Nachrichtentechnik
Genre: Technik
Rubrik: Naturwissenschaften & Technik
Medium: Taschenbuch
Reihe: SpringerBriefs in Electrical and Computer Engineering
Inhalt: xviii
69 S.
23 s/w Illustr.
6 farbige Illustr.
69 p. 29 illus.
6 illus. in color.
ISBN-13: 9781461410706
ISBN-10: 1461410703
Sprache: Englisch
Herstellernummer: 80072866
Ausstattung / Beilage: Paperback
Einband: Kartoniert / Broschiert
Autor: Chakravarty, Tapas
Sharma, Rohit
Hersteller: Springer New York
Springer US, New York, N.Y.
SpringerBriefs in Electrical and Computer Engineering
Maße: 235 x 155 x 6 mm
Von/Mit: Tapas Chakravarty (u. a.)
Erscheinungsdatum: 17.02.2012
Gewicht: 0,149 kg
Artikel-ID: 106678337
Zusammenfassung

Provides a comparative study of the available analytical and numerical approaches in modeling of high-speed electrical interconnects

Modeling aspects will be highlighted specific to interconnect geometry

Includes supplementary material: [...]

Inhaltsverzeichnis
Introduction to interconnects.- Necessity for modeling of interconnects.- Review of analytical models.- Numerical techniques and simulation approaches.- Summary.
Details
Erscheinungsjahr: 2012
Fachbereich: Nachrichtentechnik
Genre: Technik
Rubrik: Naturwissenschaften & Technik
Medium: Taschenbuch
Reihe: SpringerBriefs in Electrical and Computer Engineering
Inhalt: xviii
69 S.
23 s/w Illustr.
6 farbige Illustr.
69 p. 29 illus.
6 illus. in color.
ISBN-13: 9781461410706
ISBN-10: 1461410703
Sprache: Englisch
Herstellernummer: 80072866
Ausstattung / Beilage: Paperback
Einband: Kartoniert / Broschiert
Autor: Chakravarty, Tapas
Sharma, Rohit
Hersteller: Springer New York
Springer US, New York, N.Y.
SpringerBriefs in Electrical and Computer Engineering
Maße: 235 x 155 x 6 mm
Von/Mit: Tapas Chakravarty (u. a.)
Erscheinungsdatum: 17.02.2012
Gewicht: 0,149 kg
Artikel-ID: 106678337
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