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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Buch von Krishnendu Chakrabarty (u. a.)
Sprache: Englisch

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Beschreibung
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.
Über den Autor
Krishnendu Chakrabarty is a Professor of Electrical and Computer Engineering at Duke University. He received his PhD from University of Michigan. He is a Fellow of IEEE and a Distinguished Engineer of ACM.
Zusammenfassung

Provides a comprehensive guide to the challenges and solutions for the testing of TSV-based 3D stacked ICs

Includes in-depth explanation of key test and design-for-test technologies, emerging standards, and test- architecture and test-schedule optimizations

Encompasses all aspects of test as related to 3D ICs, including pre-bond and post-bond test as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective

Inhaltsverzeichnis

Introduction.- Wafer Stacking and 3D Memory Test.- Built-in Self-Test for TSVs.- Pre-Bond TSV Test Through TSV Probing.- Pre-Bond TSV Test Through TSV Probing.- Overcoming the Timing Overhead of Test Architectures on Inter-Die Critical Paths.- Post-Bond Test Wrappers and Emerging Test Standards.- Test-Architecture Optimization and Test Scheduling.- Conclusions.

Details
Erscheinungsjahr: 2013
Fachbereich: Nachrichtentechnik
Genre: Mathematik, Medizin, Naturwissenschaften, Technik
Rubrik: Naturwissenschaften & Technik
Medium: Buch
Inhalt: xviii
245 S.
18 s/w Illustr.
115 farbige Illustr.
245 p. 133 illus.
115 illus. in color.
ISBN-13: 9783319023779
ISBN-10: 3319023772
Sprache: Englisch
Ausstattung / Beilage: HC runder Rücken kaschiert
Einband: Gebunden
Autor: Chakrabarty, Krishnendu
Noia, Brandon
Hersteller: Springer International Publishing
Springer International Publishing AG
Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, D-69121 Heidelberg, juergen.hartmann@springer.com
Maße: 241 x 160 x 20 mm
Von/Mit: Krishnendu Chakrabarty (u. a.)
Erscheinungsdatum: 02.12.2013
Gewicht: 0,565 kg
Artikel-ID: 105546290
Über den Autor
Krishnendu Chakrabarty is a Professor of Electrical and Computer Engineering at Duke University. He received his PhD from University of Michigan. He is a Fellow of IEEE and a Distinguished Engineer of ACM.
Zusammenfassung

Provides a comprehensive guide to the challenges and solutions for the testing of TSV-based 3D stacked ICs

Includes in-depth explanation of key test and design-for-test technologies, emerging standards, and test- architecture and test-schedule optimizations

Encompasses all aspects of test as related to 3D ICs, including pre-bond and post-bond test as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective

Inhaltsverzeichnis

Introduction.- Wafer Stacking and 3D Memory Test.- Built-in Self-Test for TSVs.- Pre-Bond TSV Test Through TSV Probing.- Pre-Bond TSV Test Through TSV Probing.- Overcoming the Timing Overhead of Test Architectures on Inter-Die Critical Paths.- Post-Bond Test Wrappers and Emerging Test Standards.- Test-Architecture Optimization and Test Scheduling.- Conclusions.

Details
Erscheinungsjahr: 2013
Fachbereich: Nachrichtentechnik
Genre: Mathematik, Medizin, Naturwissenschaften, Technik
Rubrik: Naturwissenschaften & Technik
Medium: Buch
Inhalt: xviii
245 S.
18 s/w Illustr.
115 farbige Illustr.
245 p. 133 illus.
115 illus. in color.
ISBN-13: 9783319023779
ISBN-10: 3319023772
Sprache: Englisch
Ausstattung / Beilage: HC runder Rücken kaschiert
Einband: Gebunden
Autor: Chakrabarty, Krishnendu
Noia, Brandon
Hersteller: Springer International Publishing
Springer International Publishing AG
Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, D-69121 Heidelberg, juergen.hartmann@springer.com
Maße: 241 x 160 x 20 mm
Von/Mit: Krishnendu Chakrabarty (u. a.)
Erscheinungsdatum: 02.12.2013
Gewicht: 0,565 kg
Artikel-ID: 105546290
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