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Cover: 9783319356242 | Dry Etching Technology for Semiconductors | Kazuo Nojiri | Taschenbuch
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Dry Etching Technology for Semiconductors
Taschenbuch von Kazuo Nojiri
Sprache: Englisch

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Beschreibung
This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.
This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.
Inhaltsverzeichnis
Contribution of Dry Etching Technology to Progress of Semiconductor Integrated Circuit.- Mechanism of Dry Etching.- Dry Etching of Various Materials.- Dry Etching Equipments.- Dry Etching Damage.- Latest Dry Etching Technologies.- Future Challenges and Outlook for Dry Etching Technology.
Details
Medium: Taschenbuch
Originaltitel: Hajimete No Handotai Dry Etching Gijutsu
Inhalt: xiii
116 S.
123 s/w Illustr.
116 p. 123 illus.
ISBN-13: 9783319356242
ISBN-10: 3319356240
Sprache: Englisch
Herstellernummer: 978-3-319-35624-2
Ausstattung / Beilage: Previously published in hardcover
Autor: Nojiri, Kazuo
Auflage: Softcover reprint of the original 1st ed. 2015
Hersteller: Springer
Springer, Berlin
Tuttle-Mori Agency
Springer International Publishing
Abbildungen: XIII, 116 p. 123 illus.
Maße: 8 x 166 x 234 mm
Von/Mit: Kazuo Nojiri
Erscheinungsdatum: 10.09.2016
Gewicht: 0,218 kg
Artikel-ID: 111861576
Inhaltsverzeichnis
Contribution of Dry Etching Technology to Progress of Semiconductor Integrated Circuit.- Mechanism of Dry Etching.- Dry Etching of Various Materials.- Dry Etching Equipments.- Dry Etching Damage.- Latest Dry Etching Technologies.- Future Challenges and Outlook for Dry Etching Technology.
Details
Medium: Taschenbuch
Originaltitel: Hajimete No Handotai Dry Etching Gijutsu
Inhalt: xiii
116 S.
123 s/w Illustr.
116 p. 123 illus.
ISBN-13: 9783319356242
ISBN-10: 3319356240
Sprache: Englisch
Herstellernummer: 978-3-319-35624-2
Ausstattung / Beilage: Previously published in hardcover
Autor: Nojiri, Kazuo
Auflage: Softcover reprint of the original 1st ed. 2015
Hersteller: Springer
Springer, Berlin
Tuttle-Mori Agency
Springer International Publishing
Abbildungen: XIII, 116 p. 123 illus.
Maße: 8 x 166 x 234 mm
Von/Mit: Kazuo Nojiri
Erscheinungsdatum: 10.09.2016
Gewicht: 0,218 kg
Artikel-ID: 111861576
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