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The most complete, current guide to semiconductor processing
Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.
State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry.
COVERAGE INCLUDES:
- The semiconductor industry
- Properties of semiconductor materials and chemicals
- Crystal growth and silicon wafer preparation
- Wafer fabrication and packaging
- Contamination control
- Productivity and process yields
- Oxidation
- The ten-step patterning process--surface preparation to exposure; developing to final inspection
- Next generation lithography
- Doping
- Layer deposition
- Metallization
- Process and device evaluation
- The business of wafer fabrication
- Devices and integrated circuit formation
- Integrated circuits
- Packaging
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
The most complete, current guide to semiconductor processing
Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.
State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry.
COVERAGE INCLUDES:
- The semiconductor industry
- Properties of semiconductor materials and chemicals
- Crystal growth and silicon wafer preparation
- Wafer fabrication and packaging
- Contamination control
- Productivity and process yields
- Oxidation
- The ten-step patterning process--surface preparation to exposure; developing to final inspection
- Next generation lithography
- Doping
- Layer deposition
- Metallization
- Process and device evaluation
- The business of wafer fabrication
- Devices and integrated circuit formation
- Integrated circuits
- Packaging
Ch 2. Properties of Semiconductor Materials and Chemicals
Ch 3. Crystal Growth and Silicon Wafer Preparation
Ch 4. Overview of Wafer Fabrication
Ch 5. Contamination Control
Ch 6. Productivity and Process Yields
Ch 7. Oxidation
Ch 8. The Ten-Step Patterning Process--Surface Preparation to Exposure
Ch 9. The Ten-Step Patterning Process--Developing to Final Inspection
Ch 10. Advanced Photolithography Processes
Ch 11. Doping
Ch 12. Layer Deposition
Ch 13. Metalization
Ch 14. Process and Device Evaluation
Ch 15. The Business of Water Fabrication
Ch 16. Introduction to Device and Integrated Circuit Formation
Ch 17. Introduction to Integrated Circuits
Ch 18. Packaging
Glossary
Index
| Erscheinungsjahr: | 2014 |
|---|---|
| Fachbereich: | Nachrichtentechnik |
| Genre: | Importe, Technik |
| Rubrik: | Naturwissenschaften & Technik |
| Medium: | Buch |
| Inhalt: | Gebunden |
| ISBN-13: | 9780071821018 |
| ISBN-10: | 0071821015 |
| Sprache: | Englisch |
| Einband: | Gebunden |
| Autor: | Zant, Peter Van |
| Hersteller: | McGraw-Hill Education |
| Verantwortliche Person für die EU: | Libri GmbH, Europaallee 1, D-36244 Bad Hersfeld, gpsr@libri.de |
| Maße: | 241 x 196 x 35 mm |
| Von/Mit: | Peter Van Zant |
| Erscheinungsdatum: | 07.01.2014 |
| Gewicht: | 1,255 kg |
Ch 2. Properties of Semiconductor Materials and Chemicals
Ch 3. Crystal Growth and Silicon Wafer Preparation
Ch 4. Overview of Wafer Fabrication
Ch 5. Contamination Control
Ch 6. Productivity and Process Yields
Ch 7. Oxidation
Ch 8. The Ten-Step Patterning Process--Surface Preparation to Exposure
Ch 9. The Ten-Step Patterning Process--Developing to Final Inspection
Ch 10. Advanced Photolithography Processes
Ch 11. Doping
Ch 12. Layer Deposition
Ch 13. Metalization
Ch 14. Process and Device Evaluation
Ch 15. The Business of Water Fabrication
Ch 16. Introduction to Device and Integrated Circuit Formation
Ch 17. Introduction to Integrated Circuits
Ch 18. Packaging
Glossary
Index
| Erscheinungsjahr: | 2014 |
|---|---|
| Fachbereich: | Nachrichtentechnik |
| Genre: | Importe, Technik |
| Rubrik: | Naturwissenschaften & Technik |
| Medium: | Buch |
| Inhalt: | Gebunden |
| ISBN-13: | 9780071821018 |
| ISBN-10: | 0071821015 |
| Sprache: | Englisch |
| Einband: | Gebunden |
| Autor: | Zant, Peter Van |
| Hersteller: | McGraw-Hill Education |
| Verantwortliche Person für die EU: | Libri GmbH, Europaallee 1, D-36244 Bad Hersfeld, gpsr@libri.de |
| Maße: | 241 x 196 x 35 mm |
| Von/Mit: | Peter Van Zant |
| Erscheinungsdatum: | 07.01.2014 |
| Gewicht: | 1,255 kg |
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