John H. Lau: Semiconductor Advanced Packaging

Cover: 9789811613784 | Semiconductor Advanced Packaging | John H. Lau | Taschenbuch | xxii

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Beschreibung

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Über den Autor

John H. Lau, Ph.D., P.E. has been the CTO of Unimicron in Taiwan since August 2019. Prior to that, he was a Senior Technical Advisor at ASM Pacific Technology in Hong Kong for 5 years; a specialist of the Industrial Technology Research Institute in Taiwan for 4¿ years and a Senior Scientist/MTS at Hewlett-Packard Laboratory/Agilent in California for more than 25 years. He earrned a Ph.D. degree in theoretical and applied mechanics from the University of Illinois at [...] more than 40 years of R&D and manufacturing experience, he has authored or coauthored more than 480 peer-reviewed technical publications, invented more than 30 issued or pending US patents, and given more than 300 lectures/workshops/keynotes worldwide. He has authored or coauthored 20 textbooks on fan-out wafer-level packaging, 3D IC heterogeneous integration and packaging, TSV for 3D integration, advanced MEMS packaging, reliability of 2D and 3D IC interconnects, flip chip, WLP, MCM, area-array packages, WLCSP, high-density PCB, SMT, DCA, TAB, lead-free materials, soldering, manufacturing, and solder joint [...] has received many awards from the American Society of Mechanical Engineers (ASME), the Institute of Electrical and Electronics Engineers (IEEE), the Society of Manufacturing Engineers (SME) and other societies. He is an elected ASME fellow, IEEE fellow, and IMAPS fellow, and has been heavily involved in many of ASME's, IEEE's, and IMAPS' technical activities.

Zusammenfassung

Addresses advanced semiconductor packaging both in theory and practice

Comprehensively studies design, materials, process, fabrication, and reliability of various advanced semiconductor packaging technologies

Provides in-depth treatment of packaging technologies

Inhaltsverzeichnis

Recent Advance on Semiconductor Packaging.- System-in-Package.- Fan-In Wafer/Panel-Level Chip-Scale Packages.- Fan-Out Wafer/Panel-Level Packaging.- 2D, 2.1D, and 2.3D IC Integration.- 2.5D IC Integration.- 3D IC Integration.- Hybrid Bonding.- Chiplets Packaging.- Dielectric Materials.- Trends and Roadmap for Advanced Semiconductor Packaging.

Erscheinungsjahr:	2022
Fachbereich:	Nachrichtentechnik
Genre:	Technik
Rubrik:	Naturwissenschaften & Technik
Medium:	Taschenbuch
Inhalt:	xxii 498 S. 27 s/w Illustr. 530 farbige Illustr. 498 p. 557 illus. 530 illus. in color.
ISBN-13:	9789811613784
ISBN-10:	9811613788
Sprache:	Englisch
Ausstattung / Beilage:	Paperback
Einband:	Kartoniert / Broschiert
Autor:	Lau, John H.
Auflage:	1st ed. 2021
Hersteller:	Springer Singapore Springer Nature Singapore
Maße:	235 x 155 x 28 mm
Von/Mit:	John H. Lau
Erscheinungsdatum:	19.05.2022
Gewicht:	0,779 kg

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